Standard Fixed Level and Planarizing Vacuum Chucks:
Single die and piece-parts
2" wafer or substrate chuck
3" wafer or substrate chuck
4" wafer or substrate chuck
6" wafer or substrate chuck
8" wafer or substrate chuck
Custom Fixed Level and Planarizing Vacuum Chucks available upon request
Combination Fixed Level or Planarizing Vacuum Chucks:

2" chuck for single-die, piece-parts and 2" wafers/substrates
3" chuck for piece-parts, 2", and 3" wafers/substrates
4" chuck for 2", 3", and 4" wafers/substrates
6" chuck for 4", 5", and 6" wafers/substrates
8" chuck for 6" and 8" wafers/substrates
Combination vacuum chucks have multiple vacuum lines which can be individually selected and closed off as required

Backside Visible Vacuum Chucks:
(2) spot Backside Visible (BSV) chucks for 2" up to 8" wafer/substrates BSV have (2) illuminated areas on wafer center-line that are approximately 0.75" to 1.0" diameter illuminated via adjustable intensity fiber optic illuminators and fiber pipes. Minimum 1.0" split-field separation in X-direction and +/-0.8" movement in Y-direction.

(2) Co-axial fiber optic illuminators
(2) XYZ micrometer stages
(2) fixed magnification tubes
(2) 2x adapters
(2) 1/4" CCD cameras

Image Grabbing System Hardware and Software with Image Overlay Function

BSV alignment accuracy down to +/-1 micron

Backside Infrared Vacuum Chucks:
(2) spot Backside Infrared (BSIR) chucks for 2" up to 8" wafer/substrates BSIR chucks have(2) illuminated areas on wafer center-line that are approximately 0.75" to 1.0" diameter illuminated via adjustable intensity fiber optic illuminators and Quartz fiber pipes. Chucks can also be purchased with (4) or (6) illuminated spots. Requires use of Dual CCD cameras for IR imaging with infrared sensitivity from 0.8 to 1.2 microns

BSIR alignment accuracy down to +/-1 micron

Custom Recessed Vacuum Chucks:
Standard vacuum chucks can be used for wafer/substrate thickness up to maximum 0.25" (6 mm). Thicker wafers/substrates can be accommodated with custom recessed vacuum chucks